WHAT'S NEWTSMC and Apple are shifting down from 3rd gen 3nm to the first release 2nm for next year's state of the art production chipsets.
3nm had performance issues with all three of its corrected iterations, with lower speeds and throughputs actually making it out of the gate each time.
ASML is catching grief from TSMC and from Intel who had purchased one of each of the ASML scanner generations but never followed through on bulk multi line purchases (as did both TSMC and Samsung).
FinFET is completely done now, everything will be ribbon FET or gate all around on all items going forward.
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Intel is talking future plans again. Having just dumped their last major set of announced future plans due to "being overcome by events" Intel is planning on leveraging multiple AI subchips to try to make up for their current lacks vs AMD/TSMC which is running at some much improved lithography levels relative to Intel.
Intel is planning on making AI sub-chips for everybody as Intel sees separate AI chiplets for each particular need as being more efficient to make and assemble at the substrate level. Intel as a vendor is working on being able to assemble various sized chiplets from everybody/anybody in their assembly plants.
Intel is building a long term plan that is actually based on China making some big assed moves and
actually taking over Taiwan's TSMC.
TSMC continues to make progress on getting "dispersed geographically" by local plants in Arizona and Germany. These plants are early functional at 5nm now and will start up a version of 3nm soon.
2nm is coming to TSMC starting next year, and
it has a completely different gate all around tech base to it.
I would suggest holding off a year or so until the next waves settle in, and then PLEASE DO NOT BUY AN OLD STYLE BIG BOX WITH AN EXPENSIVE GRAPHICS CARD as that is very much past tense technology now-a-days.
APUs from AMD and Intel are the things to study up on before buying. Yep, the little box stuff that I just bought into.
TSMC/AMD has fully matured the little box tech that I just purchased and Intel is working on their version of equivalent tech that will be flying under their new Ultra brand name.
Powerful laptop type APUs (graphics in the CPU) are the future which is being pursued by everybody (AMD, Intel and Apple).
News from 3 days later ----- AMD core counts are all going to DOUBLE in next years planned ZEN 5 for the exact same socket size due to lithography increases and some layout changes of the newer smaller 4c style lithography cores.
At the same time Intel will be going to using new augmented AI chiplet based FOVEROS stacked formats, so expect the core count deal to become quite murky and confusing for any new Intel products.